EdgeTech+ 2025 opens tomorrow, and WeLink Solutions is ready to welcome you at PACIFICO YOKOHAMA! Under the theme “Edge AIの未来へ、お客様と共に — Empowering the Future of Edge AI,” we will showcase how WeLink drives innovation with modular design and intelligent embedded computing to build stable, secure, and efficient AI-driven applications.
As a leading provider in edge computing, WeLink delivers full-stack solutions from modules to systems, including OSM, SMARC, Qseven, NUC SBC, 3.5” SBC, PICO-ITX and more. Our platforms support Intel, NXP, Renesas, Qualcomm, MediaTek, enabling businesses to develop reliable and scalable AI applications across diverse architectures.
🚀What You’ll See at EdgeTech+ 2025
✅OSM Modular Platform – A complete lineup from entry-level to high-performance AI computing.
✅RSQ11 Series Systems – Featuring DeepX AI accelerators for powerful on-device AI inference including object detection, image analytics, and real-time decision-making.
✅KUBER / ATIS Series – Modular architecture with rapid I/O customization for diverse application needs.
✅MIWA Ultra-Compact Series – Only 7.5 × 7.5 cm, one of the smallest Intel-based systems on the market with impressive performance.
✅WISH Series Panel PCs – Powered by Intel Atom® X7000RE with DDR5 and IP65 protection for smart factory and energy management environments.
With high reliability and low-power design, these solutions deliver a strong computing foundation for industrial automation, smart healthcare, energy monitoring, and AIoT applications.
At WeLink, we believe the future of embedded technology is shaped by modularity, openness, and collaborative ecosystems. By working closely with leading semiconductor and AI technology partners, we are building a flexible and scalable Edge AI ecosystem.
📍Don’t miss out—EdgeTech+ 2025 starts tomorrow✨
Visit us at Booth CJ-09 and discover how WeLink accelerates AI innovation across industries and enables smarter applications at scale.
🚀See you in Yokohama—let’s shape the future of Edge AI together.
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