NXP i.MX 93 family processor OSM module
• NXP i.MX 93 Plus with Dual Arm® Cortex®-A55 processor
• NPU with up to 0.5 TOPS
• Onboard 2GB LPDDR4 memory and 16GB storage
• Legacy I/O and high-speed interface
• Size L module, OSM v1.1
The Open Standard Module™ specification allows developing, producing and distributing embedded modules for the most popular ARM and x86 architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces
| General | |
| CPU | NXP i.MX 93 with Dual core Cortex-A55 |
| Memory | 2G onboard LPDDR4, 3733MT/s |
| Storage | 16GB onboard eMMC 5.1 flash 32GB/64GB by project |
| Power input | 5V DC |
| Operating System | Embedded Linux (Yocto distribution) |
| Basic I/O Interface | |
| Audio | 1x I2S |
| PCI Express | N/A |
| USB | 4x USB2.0 / (1 port with OTG) |
| Display | 1x 24bit LVDS single channel 1x MIPI DSI |
| Video | 2D Graphic only |
| Camera | 1x CSI 2-lane |
| Ethernet | 2x GbE LAN (RGMII) (1 port with TSN) |
| Other Lagacy I/O | 14x GPIO, 2x I2C, 3x UART(2xRTS/CTS) 2x SPI, 2xCAN Bus, 1x SD card 2x ADC, 1x PWM, 1x JTAG |
| Mechanical | |
| Form Factor | SGeT OSM Specification v1.1 OSM size L 662 pins |
| Dimension | 45 (L) x 45 (W) mm |
| Mechanical and Environmental | |
| Operating Temperature | (-)20°C to +85°C |
| Humidity | 5-95% RH, non-condensing |
