MOSM-M330E

MOSM-M330E

NXP i.MX 93 family processor OSM module

Features

  • NXP i.MX 93 Plus with Dual Arm® Cortex®-A55 processor
  • NPU with up to 0.5 TOPS
  • Onboard 2GB LPDDR4 memory and 16GB storage
  • Legacy I/O and high-speed interface
  • Size L module, OSM v1.1

 

General
CPU NXP i.MX 93 with Dual core Cortex-A55
Memory 2G onboard LPDDR4, 3733MT/s
Storage 16GB onboard eMMC 5.1 flash
32GB/64GB by project
Power input 5V DC
Operating System Embedded Linux (Yocto distribution)
Basic I/O Interface
Audio 1 x I2S
PCI Express N/A
USB 4x USB2.0 / (1 port with OTG)
Display 1x 24bit LVDS single channel
1x MIPI DSI
Video 2D Graphic only
Camera 1x CSI 2-lane
Ethernet 2x GbE LAN (RGMII) (1 port with TSN)
Other Lagacy I/O 14x GPIO, 2x I2C, 3x UART(2xRTS/CTS)
2x SPI, 2xCAN Bus, 1x SD card
2x ADC, 1x PWM, 1x JTAG
Mechanical
Form Factor SGeT OSM Specification v1.1
OSM size L
662 pins
Dimension 45 (L) x 45 (W) mm
Mechanical and Environmental
Operating Temperature (-)20°C to +85°C
Humidity 5-95% RH, non-condensing

 

The Open Standard Module™ specification allows developing, producing and distributing embedded modules for the most popular ARM and x86 architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.